Streetwise™ spatial outlier detection is a recipe-driven bin “downgrading” of devices based on proximity to failing and outlier devices. This approach measurably reduces full-wafer scrap and ensures the reliability of "Bin 1" or "Good Bins" die.

• Configurable and flexible methods controlled via user-defined recipes.
• User-defined sensitivity and proximity settings, which are driven by the process, the product, and the user’s quality policy.

Streetwise™ offers several modules for spatial outlier detection:

Stepper and Repeating Patterns Detection and Completion

Spacial Outlier Analysis

Proximity analysis algorithms for multi- function spatial outlier detection:

• Good die in bad neighborhood
• Guard banding
• Smoothing
• Wafer edge weighting
• Corner weighting

Composite Lot and Sub-lot Level Analysis

• Considers both hardware and software bins, and Streetwise™ analysis bins from wafers in same lot.
• Analysis of wafer results at a lot level or sub-lot level to identify common patterns throughout the selected wafers.